Difference b/w Intel 4th generation and 3rd generation processors

                                   Intel had recently announced new series of their processor, the 4th generation Intel i3, i5, i7 processors. The previous version of Intel i3, i5, i7 processors are build by 32nm micro-architecture. The new processors are build by 22nm micro-architecture, main differences in the generations is Intel processors is shrinking of sizes of die in nano scaling. These 22nm 4th generation processors are codename “Haswell”. On June 4th, 2013. Intel had officially announced new CPU's with 4th generation Haswell processors at Computex Taipei 2013.

Intel 4rd generation (Haswell) processor IVB-Die

 

Difference between Intel 4th generation processors and 3rd generation.

The 3rd generation is called “Ivy Bridge,” and is basically a copy of Sandy Bridge manufactured on a smaller scale, or die. However, Intel also focused on beefing up the integrated graphics in this processor. Haswell processors are based on 22nm technology support up to 4 cores / 8 threads at 2.4GHz and 6 MB last level cache boosting computing performance while enabling the latest virtualization techniques and CPU enhancements. Onboard soldered low voltage DRAM with ECC is supported for maximum reliability and optional memory expansion via an SODIMM socket extends the capacity to up to 16GB for the most demanding applications in high performance or virtualized environments. Dual channel design and memory speeds up to 1600 MT/s along with increased cache size and enhanced cache algorithms guarantee maximum memory performance and some efficiency features, faster memory controller, a improved Integrated GPU, some new instruction sets and chipset additions and supports.

Tech Specification of new 22nm Haswell Processors :

Product Name	Intel® Core™ i7-4770S Processor (8M Cache, up to 3.90 GHz)	Intel® Core™ i7-4700EQ Processor (6M Cache, up to 3.40 GHz)	Intel® Core™ i7-4770TE Processor (8M Cache, up to 3.30 GHz)
Code Name	Haswell	Haswell	Haswell
Essentials
Status	Launched	Launched	Launched
Launch Date	Q2’13	Q2’13	Q2’13
Processor Number	i7-4770S	i7-4700EQ	i7-4770TE
# of Cores	4	4	4
# of Threads	8	8	8
Clock Speed	3.1 GHz	2.4 GHz	2.3 GHz
Max Turbo Frequency	3.9 GHz	3.4 GHz	3.3 GHz
Cache	8 MB	6 MB	8 MB
Bus Type		DMI	DMI
System Bus		5 GT/s	5 GT/s
# of QPI Links	1
Instruction Set	64-bit	64-bit	64-bit
Instruction Set Extensions	SSE 4.1/4.2, AVX 2.0	SSE 4.1/4.2, AVX 2.0	SSE 4.1/4.2, AVX 2.0
Embedded Options Available	Yes	Yes	Yes
Lithography	22nm	22 nm	22 nm
Max TDP	65 W	47 W	45 W
Thermal Solution Specification	PCG 2013C		PCG 2013B
Recommended Customer Price	TRAY: $303.00 BOX : $305.00	TRAY: $378.00	TRAY: $303.00
Memory Specifications
Max Memory Size (dependent on memory type)	32 GB	32 GB	32 GB
Memory Types	DDR3-1333/1600	DDR3L-1333,1600	DDR3-1333/1600
# of Memory Channels	2	2	2
Max Memory Bandwidth	25.6 GB/s	25.6 GB/s	25.6 GB/s
ECC Memory Supported	No	Yes	No
Graphics Specifications
Processor Graphics	Yes	Yes	Yes
Graphics Model	Intel® HD Graphics 4600	Intel® HD Graphics 4600	Intel® HD Graphics 4600
Graphics Base Frequency	350 MHz	400 MHz	350 MHz
Graphics Max Dynamic Frequency	1.2 GHz	1 GHz	1 GHz
Graphics Output		eDP/DP/HDMI/VGA
Intel® Quick Sync Video	Yes	Yes	Yes
Intel® InTru™ 3D Technology	Yes	Yes	Yes
Intel® Insider™	Yes	Yes	Yes
Intel® Wireless Display	Yes	Yes	Yes
Intel® Flexible Display Interface (Intel® FDI)		Yes	Yes
Intel® Clear Video HD Technology	Yes	Yes	Yes
# of Displays Supported	3	3	3
Expansion Options
PCI Express Revision	3.0	3.0	3.0
PCI Express Configurations	Up to 1×16, 2×8, 1×8/2×4	Up to 1×16, 2×8, 1×8 2×4	Up to 1×16, 2×8, 1×8 2×4
# of PCI Express Lanes	16	16	16
Package Specifications
Max CPU Configuration	1	1	1
TJUNCTION		100
Package Size	37.5mm x 37.5mm	37.5mm x 32mm x 1.6mm	37.5mm x 37.5mm (LGA1150)
Graphics and IMC Lithography	22nm	22 nm	22 nm
Sockets Supported	FCLGA1150	FCBGA1364	FCLGA1150
Low Halogen Options Available	See MDDS	See MDDS	See MDDS
Advanced Technologies
Intel® Turbo Boost Technology	2.0	2.0	2.0
Intel® vPro Technology	Yes	Yes	Yes
Intel® Hyper-Threading Technology	Yes	Yes	Yes
Intel® Virtualization Technology (VT-x)	Yes	Yes	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	Yes	Yes	Yes
Intel® VT-x with Extended Page Tables (EPT)	Yes	Yes	Yes
Intel® Trusted Execution Technology	Yes	Yes	Yes
AES New Instructions	Yes	Yes	Yes
Intel® TSX-NI	Yes	Yes	Yes
Intel® 64	Yes	Yes	Yes
Intel® Anti-Theft Technology	Yes	Yes	Yes
Intel® My WiFi Technology		Yes
Idle States	Yes	Yes	Yes
Enhanced Intel SpeedStep® Technology	Yes	Yes	Yes
Thermal Monitoring Technologies	Yes	Yes	Yes
Execute Disable Bit	Yes	Yes	Yes
Intel® Secure Key	Yes	Yes	Yes
Intel® Identity Protection Technology	Yes	Yes	Yes

Motherboard built with sockets LGA 1150, rPGA 947 and BGA-1364 supports new Haswell processors.

Finally words:

Without get very technical, the primary differences for the average person are relatively small.

• Haswell consumes very less power; such It can run a new MacBook for more than 12 hours (full day). – via 
• Slightly more processing power. On average with the same clock speeds Haswell CPUs are faster than 3rd generation CPUs.

Haswell is just perfect, Perfect computining, Perfect Battery life and Perfect inbuilt Perfect Graphics (IRIS Graphics).

Source & Important links: 

http://en.wikipedia.org/wiki/Haswell_(microarchitecture)

http://blog.laptopmag.com/intel-4th-generation-core-processor-benchmarked

http://en.wikipedia.org/wiki/Ivy_Bridge_(microarchitecture)

http://www.digitaltrends.com/computing/what-you-need-to-know-about-intels-4th-gen-haswell-processors/

http://ark.intel.com/compare/75610,75124,75469

http://en.wikipedia.org/wiki/LGA_1150

http://www.pcpro.co.uk/news/382363/new-macbook-air-gets-haswell-for-all-day-battery-life

 source